MANIRUZZAMAN, Md.; ALAM, S.M. Shamsul; AHSAN, Md. Shamim; HASAN, Md. Tariq; HAQUE, A.K.M. Ahsanul. ADHESION OF COPPER WITH DIFFUSION BARRIER LAYER FOR COPPER INTERCONNECTION. Khulna University Studies, [S. l.], p. 43–48, 2007. DOI: 10.53808/KUS.2007.8.1.0636-E. Disponível em: https://kus.ku.ac.bd/kustudies/article/view/350. Acesso em: 5 dec. 2024.