Maniruzzaman, Md., S.M. Shamsul Alam, Md. Shamim Ahsan, Md. Tariq Hasan, and A.K.M. Ahsanul Haque. “ADHESION OF COPPER WITH DIFFUSION BARRIER LAYER FOR COPPER INTERCONNECTION”. Khulna University Studies (May 26, 2007): 43–48. Accessed February 16, 2025. https://kus.ku.ac.bd/kustudies/article/view/350.