Maniruzzaman M, Alam SS, Ahsan MS, Hasan MT, Haque AA. ADHESION OF COPPER WITH DIFFUSION BARRIER LAYER FOR COPPER INTERCONNECTION. Khulna Univ. Stud. [Internet]. 2007 May 26 [cited 2026 Jun. 20];:43-8. Available from: https://kus.ku.ac.bd/kustudies/article/view/350